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MÁY CẮT RÃNH TIA LASER CẮT TIA PLASMA: AL300P ACCRETECH
Equipped with a high-output high-frequency pulse laser unit.
This is a Laser patterning machine developed exclusively for PSFS's* Plasma dicing machine (APX300-DM).
The AL300 enables a silicon wafer, to which a resist or other mask layer is attached in the
pre-processing stage of Plasma dicing, to be patterned at the dicing position with the specified width
and high precision through UV Laser processing.
Minimum width of 15 μm supported for Laser patterning (Depends on the device structure.)
Laser beam shape best suited to Plasma dicing.
Smaller footprint (excluding the W1180 × D1800 × H1800 coater option)
Tokyo Seimitsu's Laser patterning machine AL300P
Panasonic Smart Factory Solutions' Plasma dicer APX300-DM
PSFS has equipped the AL300P Laser patterning machine to its Plasma dicing demonstration center in Kadoma City, Osaka, establishing a framework whereby the AL300P can be tested together with PSFS's Plasma dicer APX300-DM.
LH : Hotline 0337 357 135
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